Physics-Based Model for Understanding Electromigration-Induced Cavity Evolution in Advanced Narrow Line Copper Interconnects-Reference-Cited by-同舟云学术

Physics-Based Model for Understanding Electromigration-Induced Cavity Evolution in Advanced Narrow Line Copper Interconnects

Author:

Wang Shizhao¹^ORCID,Cheng Chunmin²^ORCID,Liu Tianjian³,Zhang Hehui²,Xue Lianghao¹,Sun Yameng²^ORCID,Han Xu²,Liu Sheng¹^ORCID

Affiliation:

1. School of Power and Mechanical Engineering, Wuhan University, Wuhan, China

2. Institute of Technological Sciences, Wuhan University, Wuhan, China

3. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, China

Funder

National Natural Science Foundation of China

National Key Research and Development Program of China

Hubei Provincial Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

Reference36 articles.

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