Monte Carlo-Based Stochastic Finite Element Model for Electromigration in the Interfaces of SAC Solder and Cu Conductors with Uncertainties in Boundary Conditions-Reference-Cited by-同舟云学术

Monte Carlo-Based Stochastic Finite Element Model for Electromigration in the Interfaces of SAC Solder and Cu Conductors with Uncertainties in Boundary Conditions

Published:2022-03-22 Issue:6 Volume:51 Page:3173-3187
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Chu Liu,Shi Jiajia^ORCID,de Cursi Eduardo Souza

Funder

National Natural Science Foundation of China

Natural Science Foundation of Jiangsu Province

Natural Science Foundation of the Higher Education Institutions of Jiangsu Province

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-022-09557-z.pdf

Reference25 articles.

1. M.H.R. Jen, L.C. Liu, and Y.S. Lai, Electromigration test on void formation and failure mechanism of FCBGA lead-free solder joints. IEEE Trans. Compon. Packag. Technol. 32, 79–88 (2009).

2. L. Chu, J. Shi, and R. Braun, The impacts of material uncertainty in electro-migration of SAC solder electronic packaging by monte carlo-based stochastic finite-element model. IEEE Trans. Compon. Packag. Manuf. Technol. 11, 1864–1876 (2021).

3. M.S. Yoon, M.K. Ko, B.N. Kim, B.J. Kim, Y.B. Park, and Y.C. Joo, Line length dependence of threshold current density and driving force in eutectic SnPb and SnAgCu solder electromigration. J. Appl. Phys. 103, 073701 (2008).

4. R. An, Y. Tian, R. Zhang, and C. Wang, Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints. J. Mater. Sci. Mater. Electron. 26, 2674–2681 (2015).

5. L. Meinshausen, K. Weide-Zaage, and H. Frémont, Electro-and thermo-migration induced failure mechanisms in package on package. Microelectron. Reliab. 52, 2889–2906 (2012).