Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.370146
Reference13 articles.
1. Determination of the mechanical stress in plasma enhanced chemical vapor deposited SiO2 and SiN layers
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5. Intrinsic stress and stress gradients at the SiO2/Si interface in structures prepared by thermal oxidation of Si and subjected to rapid thermal annealing
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