Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach-Reference-Cited by-同舟云学术

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Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach

Published:2024-08 Issue:3 Volume:37 Page:251-259
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Vavrille Benjamin¹^ORCID,Vignoud Lionel²,Chapelon Laurent-Luc³^ORCID,Estevez Rafael⁴

Affiliation:

1. STMicroelectronics, Crolles, France

2. DPFT, Université Grenoble Alpes, CEA-Leti, Grenoble, France

3. Plasma Departement, STMicroelectronics, Crolles, France

4. Materials Science Department, Université Grenoble Alpes, SIMaP Laboratory, Saint-Martin d’Hères, France

Funder

“Recherche Technologique de Base” Program of the French National Research Agency (ANR) through Platform for Nanocharacterisation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx8/66/10636181/10551414.pdf?arnumber=10551414

Reference29 articles.

1. Dynamic Mechanical Analysis

2. Thickness-dependent mechanical properties of polydimethylsiloxane membranes

3. Influence of molecular weight and film thickness on the glass transition temperature and coefficient of thermal expansion of supported ultrathin polymer films

4. Anisotropy of thermal expansion of thin polyimide films

5. Thickness dependence of the anisotropy in thermal expansion of PMDA-ODA and BPDA-PDA thin films

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