Phase-field simulations of electromigration-induced defects in interconnects with non-columnar grain microstructure
Author:
Affiliation:
1. School for Engineering of Matter, Transport and Energy, Arizona State University, 551 E. Tyler Mall, Tempe, Arizona 85287, USA
Funder
National Science Foundation
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/am-pdf/10.1063/1.5145104
Reference27 articles.
1. Electromigration in submicron interconnect features of integrated circuits
2. Electromigration in metals
3. Phase-Field Modeling of Grain-Boundary Grooving Under Electromigration
4. Electromigration-Induced Surface Drift and Slit Propagation in Polycrystalline Interconnects: Insights from Phase-Field Simulations
5. Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces
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