Electromigration in submicron interconnect features of integrated circuits-Reference-Cited by-同舟云学术

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Electromigration in submicron interconnect features of integrated circuits

Published:2011-02-04 Issue:5-6 Volume:71 Page:53-86
ISSN:0927-796X
Container-title:Materials Science and Engineering: R: Reports
language:en
Short-container-title:Materials Science and Engineering: R: Reports

Author:

Ceric H.,Selberherr S.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

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