Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces-Reference-Cited by-同舟云学术

Grain boundary grooving and cathode voiding in bamboo-like metallic interconnects by surface drift diffusion under the capillary and electromigration forces

Published:2005-05 Issue:9 Volume:97 Page:093520
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Ogurtani Tarik Omer,Akyildiz Oncu

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.1883305

Reference24 articles.

1. C. Herring, inThe Physics of Powder Metallurgy, edited W. E. Kinston (McGraw-Hill, New York, 1951), p. 143.

2. J. Von-Neumann,Metal Interfaces(ASM, Cleveland, 1952), p. 108.

3. Theory of Thermal Grooving

4. W. Gibbs,The Collected Works of J. Willard Gibbs, Vol. I Thermodynamics(Yale University Press, New Haven, 1948), p. 226.

5. L. E. Murr,Interfacial Phenomena in Metals and Alloys(Addison-Wesley Reading, MA, 1975), p. 10.

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