Hexagonal WSi2in cosputtered (tungsten and silicon) mixture
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.328741
Reference10 articles.
1. 1 /spl mu/m MOSFET VLSI technology. VII. Metal silicide interconnection technology - A future perspective
2. Properties of Sputtered Tungsten Silicide for MOS Integrated Circuit Applications
3. Composite Silicide Gate Electrodes - Interconnections for VLSI Device Technologies
4. Silicide formation in thin cosputtered (titanium + silicon) films on polycrystalline silicon and SiO2.
5. Silicide formation in thin cosputtered (tantalum + silicon) films on polycrystalline silicon and SiO2
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