Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4867115
Reference37 articles.
1. Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization
2. In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing
3. Current-crowding-induced electromigration failure in flip chip solder joints
4. Stress generation by electromigration
5. Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints
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