Copper Outdiffusion from Copper-Plated Solar Cell Contacts during Damp Heat Exposure-Reference-Cited by-同舟云学术

Copper Outdiffusion from Copper-Plated Solar Cell Contacts during Damp Heat Exposure

Published:2022-03-03 Issue:10 Volume:14 Page:12149-12155
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Karas Joseph¹^ORCID,Phua Benjamin²,Mo Alvin²,Iqbal Nafis³^ORCID,Davis Kristopher³^ORCID,Bowden Stuart¹,Lennon Alison²,Augusto André¹

Affiliation:

1. Solar Power Laboratory, Arizona State University, Tempe, Arizona 85287, United States

2. School of Photovoltaic and Renewable Energy Engineering, University of New South Wales, Sydney, New South Wales 2052, Australia

3. Department of Materials Science and Engineering, University of Central Florida, Orlando, Florida 32816, United States

Funder

Australian Research Council

Division of Engineering Education and Centers

Solar Energy Technologies Program

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.1c21218

Reference54 articles.

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3. Grübel, B.; Cimiotti, G.; Arya, V.; Fellmeth, T.; Feldmann, F.; Steinhauser, B.; Kluska, S.; Kluge, T.; Landgraf, D.; Glatthaar, M. Plated Ni/Cu/Ag for TOPCon Solar Cell Metallization. 36th European Photovoltaic Solar Energy Conference and Exhibition, Marseille, 2019; pp 167–171.

4. Hydrophobic AlOx Surfaces by Adsorption of a SAM on Large Areas for Application in Solar Cell Metallization Patterning

5. Intrinsic Diffusion Coefficient of Interstitial Copper in Silicon

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