Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling

Author:

Zhang Long,Xiong Dengjie,Su Zilong,Li Junfeng,Yin Limeng,Yao Zongxiang,Wang Gang,Zhang Liping,Zhang Hehe

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference26 articles.

1. Improving tensile strength of SnAgCu/Cu solder joint through multi-elements alloying;Zhu;Mater. Today Commun.,2021

2. Modeling of growth rate and morphology mechanism of whisker and hillock on micro-bumps under temperature-pressure-humidity storage;Lin;Scr. Mater.,2022

3. The Creep Behaviors of Lead-free Micro-solder Joints and the Growth Mechanism of Tin Whisker on Coatings in Electronic Packaging (Ph.D. Dissertation);Yao,2019

4. Whisker growth in Sn coatings: a review of current status and future prospects;Jagtap;J. Electron. Mater.,2021

5. Tin whiskers prefer to grow from the [001] grains in a tin coating on aluminum substrate;Tian;J. Mater. Sci. Technol.,2021

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