Perspective: New process technologies required for future devices and scaling
Author:
Affiliation:
1. TEL Technology Center, America, LLC, 255 Fuller Rd. Suite 244, Albany, New York 12203, USA
Publisher
AIP Publishing
Subject
General Engineering,General Materials Science
Link
http://aip.scitation.org/doi/pdf/10.1063/1.5026805
Reference73 articles.
1. Cramming more components onto integrated circuits, Reprinted from Electronics, volume 38, number 8, April 19, 1965, pp.114 ff.
2. Design of ion-implanted MOSFET's with very small physical dimensions
3. Preface: Materials, metrology, and modeling for a future beyond CMOS technology
4. Emerging Applications for High K Materials in VLSI Technology
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