Preface: Materials, metrology, and modeling for a future beyond CMOS technology-Reference-Cited by-同舟云学术

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Preface: Materials, metrology, and modeling for a future beyond CMOS technology

Published:2018-05 Issue:5 Volume:6 Page:058001
ISSN:2166-532X
Container-title:APL Materials
language:en
Short-container-title:APL Materials

Author:

Antonelli G. Andrew¹,Herr Dann²,King Sean W.¹³^ORCID

Affiliation:

1. Nanometrics, Hillsboro, Oregon 97124, USA

2. School of Nanoscience and Nanoengineering, University of North Carolina Greensboro, Greensboro, North Carolina 27401, USA

3. Logic Technology Development, Intel Corporation, Hillsboro, Oregon 97124, USA

Publisher

AIP Publishing

Subject

General Engineering,General Materials Science

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5037331

Reference12 articles.

1. Cramming More Components Onto Integrated Circuits

2. The Multiple Lives of Moore's Law

3. Moore's Law is Dying (and that could be good)

4. The chips are down for Moore’s law

5. Less is Moore

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1. Extending growth inhibition during area-selective atomic layer deposition of Al₂O₃ on aminosilane-functionalized SiO₂;Chemical Communications;2022

2. Mechanism for growth initiation on aminosilane-functionalized SiO2 during area-selective atomic layer deposition of ZrO2;Journal of Vacuum Science & Technology A;2021-05

3. Surface reaction mechanisms during atomic layer deposition of zirconium oxide using water, ethanol, and water-ethanol mixture as the oxygen sources;Journal of Vacuum Science & Technology A;2020-01

4. Review—Beyond the Highs and Lows: A Perspective on the Future of Dielectrics Research for Nanoelectronic Devices;ECS Journal of Solid State Science and Technology;2019

5. Perspective: New process technologies required for future devices and scaling;APL Materials;2018-05

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