Rapid thermal chemical vapor deposition ofin situboron-doped polycrystalline silicon-germanium films on silicon dioxide for complimentary-metal-oxide-semiconductor applications
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.120344
Reference11 articles.
1. Junction Formation and Poly‐Si Doping for Scaled Sub‐Micron CMOS Technology
2. Rapid Thermal Chemical Vapor Deposition of Germanium and Germanium/Silicon Alloys on Silicon: New Applications in the Fabrication of MOS Transistors
3. Low Pressure Chemical Vapor Deposition of Si1 − x Ge x Films on SiO2 : Characterization and Modeling
4. Polycrystalline silicon–germanium films on oxide using plasma‐enhanced very‐low‐pressure chemical vapor deposition
5. Effects of SiH4, GeH4, and B 2 H 6 on the Nucleation and Deposition of Polycrystalline Si1 − x Ge x Films
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1. Low-Stress Highly-Conductive In-Situ Boron Doped Ge0.7Si0.3Films by LPCVD;ECS Journal of Solid State Science and Technology;2012
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3. Effects of atomic hydrogen on the selective area growth of Si and Si[sub 1−x]Ge[sub x] thin films on Si and SiO[sub 2] surfaces: Inhibition, nucleation, and growth;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2004
4. The role of carbon on the electrical properties of polycrystalline Si1−yCy and Si0.82−yGe0.18Cy films;Journal of Applied Physics;2001-12-15
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