Optical role of die attach adhesive for white LED emitters: light output enhancement without chip-level reflectors-Reference-Cited by-同舟云学术

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Optical role of die attach adhesive for white LED emitters: light output enhancement without chip-level reflectors

Published:2015-12 Issue:1 Volume:2 Page:
ISSN:2196-1107
Container-title:Journal of Solid State Lighting
language:en
Short-container-title:J Sol State Light

Author:

Kim Gunwoo,Shih Yu-Chou,You Jiun-Pyng,Shi Frank G.

Publisher

Springer Science and Business Media LLC

Link

http://link.springer.com/content/pdf/10.1186/s40539-015-0031-z.pdf

Reference21 articles.

1. Huang HW, Lin CH, Yu CC, Lee BD, Chiu CH, Lai CF, Kuo HC, Leung KM, Lu TC, Wang SC (2008) Enhanced light output from a nitride-based power chip of green light-emitting diodes with nano-rough surface using nanoimprint lithography. Nanotechnology 19(18):185301

2. Masui H, Yamada H, Iso K, Speck JS, Nakamura S, DenBaars SP (2008) Non-polar-oriented InGaN light-emitting diodes for liquid-crystal-display backlighting. J Soc Inf Disp 16(4):571–578

3. Lee C-L, Lee S-C, Lee W-I (2006) Nonlithographic Random Masking and Regrowth of GaN Microhillocks to Improve Light-Emitting Diode Efficiency. Jpn J Appl Phys 45(1L):L4

4. Chen H, Guo H, Zhang P, Zhang X, Liu H, Wang S, Cui Y (2013) Enhanced Performance of GaN-Based Light-Emitting Diodes by Using Al Mirror and Atomic Layer Deposition-TiO2 /Al2O3 Distributed Bragg Reflector Backside Reflector with Patterned Sapphire Substrate. Appl Phys Express 6(2):022101

5. Lin NM, Shei S, Chang S (2011) Nitride-Based LEDs With High-Reflectance and Wide-Angle Ag Mirror + SiO2 /TiO2 DBR Backside Reflector. J Light Technol 29(7):1033–1038

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparative Study of Die-Attach Materials for LED Die Bonding;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

2. Systematic Investigation and Characterization of Ag Paste for LED Die Attach;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07

3. Printable optically transparent adhesive processing for bonding of LED chips to packages;Materials Science in Semiconductor Processing;2016-12

4. LED Die Bonding;Materials for Advanced Packaging;2016-11-19

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