Printable optically transparent adhesive processing for bonding of LED chips to packages

Author:

Shih Yu-Chou,Kim Gunwoo,You Jiun-Pyng,Shi Frank G.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference13 articles.

1. Progress of LED backlights for LCDs;Anandan;J. Soc. Inf. Disp.,2008

2. Role of transparent die attach adhesives for enhancing lumen output of midpower LED emitters with standard MESA structure;Shih;IEEE Trans. Compon. Packag. Technol.,2015

3. P.Y. Chou, Y.P. Huang, C.H. Hung, et al., 66.2: Optimization of LED arrangement for extending LED binning range in backlight system, in: SID Symposium Digest of Technical Papers, vol. 43 (1) 2012, pp. 897–900.

4. Gunwoo Kim, Yu-Chou Shih, Frank G. Shi, White LED Manufacturing: Impact of Packaging on Lumen Output Consistency and Binning, 2016 (in preparation).

5. Optical role of die attach adhesives for white LED emitters: light output enhancement without chip-level reflectors;Kim;J. Solid State Light,2015

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