Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives
Author:
Affiliation:
1. Research and Development Center, ROHM Co., Ltd., Kyoto, Japan
2. Institute for Materials Chemistry and Engineering and IRCCS, Kyushu University, Fukuoka, Japan
Funder
Core Research for Evolutional Science and Technology
Japan Society for the Promotion of Science
Publisher
Informa UK Limited
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry
Link
https://www.tandfonline.com/doi/pdf/10.1080/00218464.2020.1807958
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