Systematic Investigation and Characterization of Ag Paste for LED Die Attach-Reference-Cited by-同舟云学术

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Systematic Investigation and Characterization of Ag Paste for LED Die Attach

Published:2021-12-07 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
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Author:

Hu Liangxing,Tao Jing,Bao Shuyu,Goh Simon Chun Kiat,Lim Yu Dian,Zhao Peng,Lim Michael Joo Zhong,Tan Sai Choo,Chew Kai Hwa,Tan Chuan Seng

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9663571/9663865/09663936.pdf?arnumber=9663936

Reference13 articles.

1. Development of a CMOS-Compatible Carbon Nanotube Array Transfer Method

2. High-performance AlGaInP light-emitting diodes integrated on silicon through a superior quality germanium-on-insulator

3. High power density LED modules with silver sintering die attach on aluminum nitride substrates

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Time Evolution Study of Two-Step Plasma-Treated Copper-Copper Direct Bonding in Ambient;2023 International Conference on Electronics Packaging (ICEP);2023-04-19

2. Comparative Study of Die-Attach Materials for LED Die Bonding;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Plasma-Activated Cu-Cu and Al-Al Direct Bonding for Electronics Packaging;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26

4. Two-Step Ar/N₂ Plasma-Activated Al Surface for Al-Al Direct Bonding;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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