Author:
Schneider Marc,Leyrer Benjamin,Herbold Christian,Maikowske Stefan
Cited by
4 articles.
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1. Comparative Study of Die-Attach Materials for LED Die Bonding;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
2. Systematic Investigation and Characterization of Ag Paste for LED Die Attach;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07
3. Thermal characteristics of a compact LED luminaire with a cooling system based on heat pipes;Thermal Science and Engineering Progress;2020-08
4. Sintered Silver for LED Applications;Die-Attach Materials for High Temperature Applications in Microelectronics Packaging;2019