Comparative Study of Die-Attach Materials for LED Die Bonding-Reference-Cited by-同舟云学术

Comparative Study of Die-Attach Materials for LED Die Bonding

Published:2022-12-07 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
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Author:

Hu Liangxing¹,Bao Shuyu²,Wang Yue²,Kiat Goh Simon Chun³,Lim Yu Dian¹,Zhao Peng¹,Lim Michael Joo Zhong¹,Miao Weiyang¹,Dinh Van Quy¹,Tan Sai Choo⁴,Chew Kai Hwa⁴,Tan Chuan Seng¹

Affiliation:

1. School of Electrical and Electronic Engineering, Nanyang Technological University,Singapore,639798

2. Low Energy Electronic Systems (LEES), Singapore-MIT Alliance for Research and Technology (SMART),Singapore,138602

3. POET Technologies,Singapore,498774

4. Quantum Chemical Technologies (S) Pte Ltd,Singapore,609288

Funder

Agency for Science, Technology and Research (A*STAR)

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013260.pdf?arnumber=10013260

Reference21 articles.

1. Circular steering of gold–nickel–platinum micro-vehicle using singular off-center nanoengine

2. Ar/N2 Plasma Induced Metastable CuxNy for Cu-Cu Direct Bonding;hu;ECS Meeting Abstracts,2020

3. Time-Dependent Evolution Study of Ar/N2 Plasma-Activated Cu Surface for Enabling Two-Step Cu-Cu Direct Bonding in a Non-Vacuum Environment

4. Sputtered Copper Nitride-Copper Nitride Direct Bonding

5. Multi-Die to Wafer Bonding Through Plasma-Activated Cu-Cu Direct Bonding in Ambient Conditions

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