Sputtered Copper Nitride-Copper Nitride Direct Bonding
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9598345/9598191/09598450.pdf?arnumber=9598450
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Comparison of Different Copper Nitride Passivation Layers Fabrication Methodology and Optimal Growth Condition for Low Temperature Copper-to-Copper Bonding in Advanced Packaging;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Reliability Study of Two-Step Plasma-Activated Copper-Copper Direct Bonding in Ambient;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08
3. Time Evolution Study of Two-Step Plasma-Treated Copper-Copper Direct Bonding in Ambient;2023 International Conference on Electronics Packaging (ICEP);2023-04-19
4. A Low-Cost Passivation for Low Temperature Cu-Cu Bonding Using PVD-Deposited Cu3N;IEEE Journal of the Electron Devices Society;2023
5. Comparative Study of Die-Attach Materials for LED Die Bonding;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
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