Conformality of atomic layer deposition in microchannels: impact of process parameters on the simulated thickness profile-Reference-Cited by-同舟云学术

Conformality of atomic layer deposition in microchannels: impact of process parameters on the simulated thickness profile

Published:2022 Issue:15 Volume:24 Page:8645-8660
ISSN:1463-9076
Container-title:Physical Chemistry Chemical Physics
language:en
Short-container-title:Phys. Chem. Chem. Phys.

Author:

Yim Jihong¹^ORCID,Verkama Emma¹^ORCID,Velasco Jorge A.¹^ORCID,Arts Karsten²^ORCID,Puurunen Riikka L.¹^ORCID

Affiliation:

1. Department of Chemical and Metallurgical Engineering, Aalto University, P.O. Box 16100, FI-00076 AALTO, Finland

2. Department of Applied Physics, Eindhoven University of Technology, P.O. Box 513, 5600 MB Eindhoven, The Netherlands

Abstract

We simulated thickness profiles of atomic layer deposited thin films by a diffusion–reaction model in two flow regimes. The thickness profiles were affected by process parameters such as density of film, sticking coefficient, and growth per cycle.

Funder

Academy of Finland

Aalto-Yliopisto

Publisher

Royal Society of Chemistry (RSC)

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://pubs.rsc.org/en/content/articlepdf/2022/CP/D1CP04758B

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