Atomic layer deposition in advanced display technologies: from photoluminescence to encapsulation

Abstract

Abstract Driven by the growing demand for next-generation displays, the development of advanced luminescent materials with exceptional photoelectric properties is rapidly accelerating, with such materials including quantum dots and phosphors, etc. Nevertheless, the primary challenge preventing the practical application of these luminescent materials lies in meeting the required durability standards. Atomic layer deposition (ALD) has, therefore, been employed to stabilize luminescent materials, and as a result, flexible display devices have been fabricated through material modification, surface and interface engineering, encapsulation, cross-scale manufacturing, and simulations. In addition, the appropriate equipment has been developed for both spatial ALD and fluidized ALD to satisfy the low-cost, high-efficiency, and high-reliability manufacturing requirements. This strategic approach establishes the groundwork for the development of ultra-stable luminescent materials, highly efficient light-emitting diodes (LEDs), and thin-film packaging. Ultimately, this significantly enhances their potential applicability in LED illumination and backlighted displays, marking a notable advancement in the display industry.