Funder
Japan Society for the Promotion of Science London
Fonds Wetenschappelijk Onderzoek
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Instrumentation,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. Beyne, E. The rise of the 3rd dimension for system integration. In Proc. 2006 IEEE International Interconnect Technology Conference 1–5 https://doi.org/10.1109/IITC.2006.1648629 (IEEE, 2006).
2. Beyne, E. The 3-D interconnect technology landscape. IEEE Des. Test 33, 8–20 (2016).
3. Garrou, P., Bower, C. & Ramm, P. Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (Wiley, 2008).
4. Gambino, J. P., Adderly, S. A. & Knickerbocker, J. U. An overview of through-silicon-via technology and manufacturing challenges. Microelectron. Eng. 135, 73–106 (2015).
5. Van der Plas, G. et al. Design issues and considerations for low-cost 3D TSV IC technology. In Proc. IEEE International Solid-State Circuits Conference (ISSCC) 148–149 (IEEE, 2010).
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