Thermal Interface Materials with High Thermal Conductivity and Low Young’s Modulus Using a Solid–Liquid Metal Codoping Strategy-Reference-Cited by-同舟云学术

Thermal Interface Materials with High Thermal Conductivity and Low Young’s Modulus Using a Solid–Liquid Metal Codoping Strategy

Published:2023-01-05 Issue:2 Volume:15 Page:3534-3542
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Zhang Xu-Dong¹,Zhang Zi-Tong¹,Wang Hong-Zhang²,Cao Bing-Yang¹^ORCID

Affiliation:

1. Key Laboratory for Thermal Science and Power Engineering of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing100084, China

2. Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing100084, China

Funder

China Postdoctoral Science Foundation

National Natural Science Foundation of China

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.2c20713

Reference47 articles.

1. Present and future thermal interface materials for electronic devices

2. Interface thermal resistance and thermal conductivity of polymer composites at different types, shapes, and sizes of fillers: A review

3. Performance of Thermal Interface Materials

4. Polyethylene nanofibres with very high thermal conductivities

5. Thermal conductivity of diamond between 170 and 1200 K and the isotope effect

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