Interface thermal resistance and thermal conductivity of polymer composites at different types, shapes, and sizes of fillers: A review-Reference-Cited by-同舟云学术

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Interface thermal resistance and thermal conductivity of polymer composites at different types, shapes, and sizes of fillers: A review

Published:2021-03-24 Issue:6 Volume:42 Page:2629-2652
ISSN:0272-8397
Container-title:Polymer Composites
language:en
Short-container-title:Polymer Composites

Author:

Jasmee Solehah¹^ORCID,Omar Ghazali¹²,Othaman Siti Syahirah Che¹,Masripan Nor Azmmi¹²,A. Hamid Husna¹

Affiliation:

1. Faculty of Mechanical Engineering Universiti Teknikal Malaysia Melaka Melaka Malaysia

2. Advanced Manufacturing Centre (AMC) Universiti Teknikal Malaysia Melaka Melaka Malaysia

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Ceramics and Composites

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pc.26029

Reference100 articles.

1. H.Wang D.Yang M.Cai X.Wang Z.Liang inProc. 2018 19th Int. Conf. Electronic Packaging Technology (ICEPT) IEEE Shanghai China 2018.

2. Fabrication of thermally conductive composite with surface modified boron nitride by epoxy wetting method

3. Mechanical, thermal and electrical properties of aluminum nitride/polyetherimide composites

4. H.Zheng Ph.D. Thesis Virginia Polytechnic Institute and State University (Blacksburg VA)2015.

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