Highly thermally conductive BNNS/PANF dielectric composite boards prepared by a facile compression moulding process-Reference-Cited by-同舟云学术

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Highly thermally conductive BNNS/PANF dielectric composite boards prepared by a facile compression moulding process

Published:2024-12 Issue: Volume:349-350 Page:118530
ISSN:0263-8223
Container-title:Composite Structures
language:en
Short-container-title:Composite Structures

Author:

Zhao Shen,Wu Zhixiong,Han Yemao,Jiang Di,Xiang Yue,Geng Zhen,Li Laifeng,Xie Chunjie,Miao Zhicong,Huang Rongjin

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Chinese Academy of Sciences

Ministry of Science and Technology of the People's Republic of China

Publisher

Elsevier BV

Reference50 articles.

1. Emerging challenges and materials for thermal management of electronics;Moore;Mater Today,2014

2. A Review on transient thermal management of electronic devices;Mathew;J Electron Packag,2022

3. Recent Advances in design and preparation of polymer-based thermal management material;Zhang;Polymers,2021

4. Engineering of polymer-based materials for thermal management solutions;Maqbool;Compos Commun,2022

5. A Roadmap Review of thermally conductive polymer composites: critical factors, progress, and prospects;Wang;Adv Funct Mater,2023

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