Present and future thermal interface materials for electronic devices-Reference-Cited by-同舟云学术

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Present and future thermal interface materials for electronic devices

Published:2017-03-27 Issue:1 Volume:63 Page:1-21
ISSN:0950-6608
Container-title:International Materials Reviews
language:en
Short-container-title:International Materials Reviews

Author:

Razeeb Kafil M.¹^ORCID,Dalton Eric²,Cross Graham Lawerence William³,Robinson Anthony James⁴⁵

Affiliation:

1. Tyndall National Institute, University College Cork, Cork, Ireland

2. Stokes Laboratories, University of Limerick, Limerick, Ireland

3. School of Physics, CRANN Nanotechnology Institute, Trinity College Dublin, Dublin 2, Ireland

4. Department of Mechanical & Manufacturing Engineering, Trinity College Dublin, Dublin 2, Ireland

5. CONNECT, Dunlop Oriel House, Trinity College, Dublin, Ireland

Funder

Horizon 2020

Science Foundation Ireland

Publisher

Informa UK Limited

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Link

https://www.tandfonline.com/doi/pdf/10.1080/09506608.2017.1296605

Reference105 articles.

1. Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

2. Silver nanowire array-polymer composite as thermal interface material

3. Novel nanostructured thermal interface materials: a review

4. Reliability of thermal interface materials: A review

5. Characterization of nanostructured thermal interface materials – A review

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