Thermal interface materials with low modulus and high thermal conductivity by manipulating multi-branched PDMS network: The disentanglement and entanglement effect of dangling chain-Reference-Cited by-同舟云学术

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Thermal interface materials with low modulus and high thermal conductivity by manipulating multi-branched PDMS network: The disentanglement and entanglement effect of dangling chain

Published:2024-09 Issue: Volume:495 Page:153352
ISSN:1385-8947
Container-title:Chemical Engineering Journal
language:en
Short-container-title:Chemical Engineering Journal

Author:

Zhang Zhian,Wen Zhibin,Sheng Jiashuo,Zeng Chen,Fan Jianfeng,Ren Linlin^ORCID,Zeng Xiaoliang,Sun Rong,Chen Peng

Publisher

Elsevier BV

Reference42 articles.

1. Present and future thermal interface materials for electronic devices;Razeeb;Int. Mater. Rev.,2017

2. Highly-safe and ultra-stable all-flexible gel polymer lithium ion batteries aiming for scalable applications;Shen;Adv. Energy Mater.,2020

3. Arresting grain boundaries with topology;Ball;Nat. Mater.,2021

4. capacitively coupled hybrid ion gel and carbon nanotube thin-film transistors for low voltage flexible logic circuits;Choi;Adv. Funct. Mater.,2018

5. Soft actuators for small-scale robotics;Hines;Adv. Mater.,2017

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