Performance of Thermal Interface Materials-Reference-Cited by-同舟云学术

Performance of Thermal Interface Materials

Published:2022-03-09 Issue:16 Volume:18 Page:2200693
ISSN:1613-6810
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language:en
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Author:

Chung D.D.L.¹^ORCID

Affiliation:

1. Composite Materials Research Laboratory Department of Mechanical and Aerospace Engineering University at Buffalo The State University of New York Buffalo NY 14260 USA

Publisher

Wiley

Subject

Biomaterials,Biotechnology,General Materials Science,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/smll.202200693

Reference61 articles.

1. Millefeuille‐Inspired Thermal Interface Materials based on Double Self‐Assembly Technique for Efficient Microelectronic Cooling and Electromagnetic Interference Shielding

2. Strategies for enhancing thermal conductivity of polymer-based thermal interface materials: a review

3. Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

4. Noncuring Graphene Thermal Interface Materials for Advanced Electronics

5. Through-plane assembly of carbon fibers into 3D skeleton achieving enhanced thermal conductivity of a thermal interface material

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