Poly(ionic liquid)s: A Promising Matrix for Thermal Interface Materials-Reference-Cited by-同舟云学术

Poly(ionic liquid)s: A Promising Matrix for Thermal Interface Materials

Published:2024-08-20 Issue:34 Volume:16 Page:45563-45576
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Zeng Jianhui¹²,Liang Ting³,Yang Baohao¹,Rao Taoying²,Han Meng¹^ORCID,Yao Yimin¹^ORCID,Xu Jian-Bin³^ORCID,Li Liejun²,Sun Rong¹^ORCID

Affiliation:

1. State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

2. Guangdong Key Laboratory for Processing and Forming of Advanced Metallic Materials, School of Mechanical & Automotive Engineering, South China University of Technology, 381 Wushan, Guangzhou 510640, China

3. Department of Electronics Engineering, The Chinese University of Hong Kong, Hong Kong 999077, China

Funder

Research Grants Council, University Grants Committee

National Key Research and Development Program of China

Basic and Applied Basic Research Foundation of Guangdong Province

National Natural Science Foundation of China

Shenzhen Science and Technology Innovation Program

Autonomous deployment project of China National Key Laboratory of Materials for Integrated Circuits

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.4c09914

Reference69 articles.

1. The chips are down for Moore’s law

2. Emerging challenges and materials for thermal management of electronics

3. Performance of Thermal Interface Materials

4. Phonon-engineered extreme thermal conductivity materials

5. Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management