Thermal Chemistry of Cu(I)-Iminopyrrolidinate and Cu(I)-Guanidinate Atomic Layer Deposition (ALD) Precursors on Ni(110) Single-Crystal Surfaces
Author:
Affiliation:
1. Department of Chemistry, University of California, Riverside, California 92521, United States
2. Department of Chemistry, Carleton University, Ottawa, Ontario, K1S5B6, Canada
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/cm401707h
Reference62 articles.
1. Sherman, A.Chemical Vapor Deposition for Microelectronics: Principles, Technology, and Applications;William Andrew Publications:New York, 1987; 215pp.
2. Low-temperature metal-organic chemical vapor deposition (LTMOCVD) of device-quality copper films for microelectronic applications
3. The surface chemistry of thin film atomic layer deposition (ALD) processes for electronic device manufacturing
4. Atomic Layer Deposition: An Overview
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