Negative Tone Metallic Organic Resists with Improved Sensitivity for Plasma Etching: Implications for Silicon Nanostructure Fabrication and Photomask Production-Reference-Cited by-同舟云学术

Negative Tone Metallic Organic Resists with Improved Sensitivity for Plasma Etching: Implications for Silicon Nanostructure Fabrication and Photomask Production

Published:2022-11-30 Issue:12 Volume:5 Page:17538-17543
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Chaker Ahmad¹^ORCID,Alty Hayden A.¹,Winpenny Paul²,Whitehead George F. S.¹^ORCID,Timco Grigore A.¹,Lewis Scott M.¹³²^ORCID,Winpenny Richard E. P.¹²^ORCID

Affiliation:

1. Department of Chemistry, The University of Manchester, Oxford Road, Manchester M13 9PL, U.K.

2. Sci-Tron Ltd, 34 High Street, Aldridge, Walsall WS9 8LZ, U.K.

3. The Kavli Nanoscience Institute, California Institute of Technology, 1200 East California Boulevard, 107-81, Pasadena, California 91125, United States

Funder

Engineering and Physical Sciences Research Council

University of Manchester

H2020 European Research Council

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsanm.2c02986

Reference31 articles.

1. Lithography today: challenges and solutions across a diverse market

2. EUV progress toward HVM readiness

3. Current challenges and opportunities for EUV lithography

4. EUV Lithography: New Metrology Challenges

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