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EUV progress toward HVM readiness

  • Published:2016-03-18 Issue: Volume: Page:
  • ISSN:0277-786X
  • Container-title:Extreme Ultraviolet (EUV) Lithography VII
  • language:
  • Short-container-title:

Author:

Turkot Britt1,Carson Steven L.1,Lio Anna1,Liang Ted1,Phillips Mark1,McCool Brian1,Stenehjem Eric1,Crimmins Tim1,Zhang Guojing1,Sivakumar Sam1

Affiliation:

1. Intel Corp. (United States)

Publisher

SPIE

Reference4 articles.

1. EUV lithography performance for manufacturing: status and outlook;Pirati,2016

2. EUV mask infrastructure readiness for technology development and HVM;Liang,2015

3. Cost effective shrink with Holistic Lithography, extended by EUV;van den Brink,2015

4. Progress on EUV Pellicle Development;Zoldesi,2014

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4. Rapid profile reconstruction of phase defects via machine-learning regression model;International Conference on Extreme Ultraviolet Lithography 2022;2022-12-01

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