Atomic Layer Deposition of Aluminum Metal Films Using a Thermally Stable Aluminum Hydride Reducing Agent
Author:
Affiliation:
1. Department of Chemistry, Wayne State University, 5101 Cass Avenue, Detroit, Michigan 48202, United States
Funder
BASF Corporation
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.chemmater.8b00445
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