Self-Aligned Nanopatterning and Controlled Lateral Growth by Dual-Material Orthogonal Area-Selective Deposition of Poly(3,4-ethylenedioxythiophene) and Tungsten
Author:
Affiliation:
1. Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
Funder
Semiconductor Research Corporation
Publisher
American Chemical Society (ACS)
Subject
Materials Chemistry,General Chemical Engineering,General Chemistry
Link
https://pubs.acs.org/doi/pdf/10.1021/acs.chemmater.3c00530
Reference41 articles.
1. Perspective: New process technologies required for future devices and scaling
2. Area-Selective Atomic Layer Deposition: Conformal Coating, Subnanometer Thickness Control, and Smart Positioning
3. From the Bottom-Up: Toward Area-Selective Atomic Layer Deposition with High Selectivity
4. Area-Selective Deposition: Fundamentals, Applications, and Future Outlook
5. Overlay and edge placement control strategies for the 7nm node using EUV and ArF lithography
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3. Low‐Temperature Dual‐Material Area‐Selective Deposition: Molybdenum Hexafluoride‐Mediated SiO2 Fluorination/Passivation for Self‐Aligned Molybdenum/Metal Oxide Nanoribbons;Advanced Functional Materials;2024-04-25
4. In situ differential atomic force microscopy (AFM) measurement for ultra-thin Thiol SAM patterns by area-selective deposition technique;Surfaces and Interfaces;2024-03
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