Modification of Porous Ultralow-<i>k</i> Film by Vacuum Ultraviolet Emission-Reference-Cited by-同舟云学术

Modification of Porous Ultralow-k Film by Vacuum Ultraviolet Emission

Published:2022-06-08 Issue:6 Volume:4 Page:2760-2776
ISSN:2637-6113
Container-title:ACS Applied Electronic Materials
language:en
Short-container-title:ACS Appl. Electron. Mater.

Author:

Zotovich Alexey I.¹^ORCID,Zyryanov Sergey M.¹²,Lopaev Dmitry V.¹^ORCID,Rezvanov Askar A.³,Attallah Ahmed G.⁴⁵^ORCID,Liedke Maciej O.⁴,Butterling Maik⁴,Bogdanova Maria A.¹²^ORCID,Vishnevskiy Alexey S.⁶,Seregin Dmitry S.⁶,Vorotyntsev Dmitry A.⁶,Palov Alexander P.¹^ORCID,Hirschmann Eric⁴,Wagner Andreas⁴,Naumov Sergej⁷,Vorotilov Konstantin A.⁶^ORCID,Rakhimova Tatyana V.¹,Rakhimov Alexander T.¹²,Baklanov Mikhail R.⁸^ORCID

Affiliation:

1. Skobeltsyn Insitute of Nuclear Physics, Moscow State University, Moscow 119991, Russian Federation

2. Faculty of Physics, Lomonosov Moscow State University, Moscow 119991, Russian Federation

3. Molecular Electronics Research Institute, Zelenograd 124460, Moscow, Russian Federation

4. Institute of Radiation Physics, Helmholtz-Zentrum Dresden-Rossendorf (HZDR), Dresden 01328, Germany

5. Physics Department, Faculty of Science, Minia University, Minia 61519, Egypt

6. MIREA─Russian Technological University (RTU MIREA), Moscow 119454, Russian Federation

7. Leibniz Institute of Surface Engineering (IOM), Leipzig 04318, Germany

8. European Centre for Knowledge and Technology Transfer (EUROTEX), Brussels 1040, Belgium

Funder

Russian Science Foundation

Ministry of Science and Higher Education of the Russian Federation

Helmholtz Association

Helmholtz Energy Materials Characterization Platform

Publisher

American Chemical Society (ACS)

Subject

Materials Chemistry,Electrochemistry,Electronic, Optical and Magnetic Materials

Link

https://pubs.acs.org/doi/pdf/10.1021/acsaelm.2c00281

Reference77 articles.

1. Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

2. Plasma processing of low-k dielectrics

3. Low dielectric constant materials for microelectronics

4. Advanced Interconnects for ULSI Technology

5. Low Dielectric Constant Materials

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