Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art-Reference-Cited by-同舟云学术

Progress in the development and understanding of advanced low k and ultralow k dielectrics for very large-scale integrated interconnects—State of the art

Published:2014-03 Issue:1 Volume:1 Page:011306
ISSN:1931-9401
Container-title:Applied Physics Reviews
language:en
Short-container-title:Applied Physics Reviews

Author:

Grill Alfred,Gates Stephen M.,Ryan Todd E.,Nguyen Son V.,Priyadarshini Deepika

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4861876

Reference54 articles.

1. A. K. Stamper, V. McGahay, and J. Hummel, in Proceedings of 2nd International Symposium on Low and High Dielectric Constant Materials-Material Science, Processing and Reliability Issues (1997), Vol. 97, issue 8, p. 1.

2. Full copper wiring in a sub-0.25 μm CMOS ULSI technology

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