Damage to OSG low‐ <i>k</i> films during IPVD deposition of the Ta barrier layer-Reference-Cited by-同舟云学术

Damage to OSG low‐ k films during IPVD deposition of the Ta barrier layer

Published:2022-12-22 Issue:4 Volume:20 Page:
ISSN:1612-8850
Container-title:Plasma Processes and Polymers
language:en
Short-container-title:Plasma Processes & Polymers

Author:

Serov Alexander O.¹,Ryabinkin Alexey N.¹^ORCID,Vishnevskiy Alexey S.²^ORCID,Naumov Sergej³,Pal Alexander F.¹,Rakhimova Tatyana V.¹,Seregin Dmitry S.²^ORCID,Vorotilov Konstantin A.²^ORCID,Baklanov Mikhail R.⁴^ORCID

Affiliation:

1. Department of microelectronics, Skobeltsyn Institute of Nuclear Physics Lomonosov Moscow State University (SINP MSU) Moscow Russian Federation

2. Research and Educational Center “Technological Center” MIREA — Russian Technological University (RTU MIREA) Moscow Russian Federation

3. Leibniz Institute of Surface Engineering (IOM) Leipzig Germany

4. European Centre for Knowledge and Technology Transfer (EUROTEX) Brussels Belgium

Funder

Russian Science Foundation

Publisher

Wiley

Subject

Polymers and Plastics,Condensed Matter Physics

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/ppap.202200169

Reference76 articles.

1. R.Brain 2016IEEEInt. Electron Devices Meet. (IEDM) IEEE San Francisco California USA 2016 9.3.1.

2. Z.Tokei 2016 IEEE Int. Intercon. Technol. Conf./Adv. Metal. Conf.IEEE San Jose California USA 2016 1.

3. Non-destructive characterisation of porous low-k dielectric films

4. Dependence of dielectric constant of hydrocarbon bridged low-k films on porosity

5. Porosity scaling strategies for low-kfilms

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Challenges in scaling of IPVD deposited Ta barriers on OSG low‐k films: Carbonization of Ta by CH_x radicals generated through VUV‐induced decomposition of carbon‐containing groups;Plasma Processes and Polymers;2024-01-22