1. Natarajan, S., Amstrong, M., Bost, M., Brain, R., Brazier, M., Chang, C.H., Chikarmane, V., Childs, M., Deshande, H. Dev, K., Ding, G., Ghani, T., Golonzka, O., Han, W., He, J., Heussner, R., James, R., Jin, I., Kenyon, C., Klopcic, S., Lee, S.H., Liu, M., Lodha, S., McFadden, B., Murthy, A., Neiberg, L., Neirynck, J., Packan, P., Pae, S., Parker, C., Pelto, C., Pipes, L., Sebastian, J., Seiple, J., Sell, B., Sivakumar, S., Song, B., Tone, K., Troeger, T., Weber, C., Yang, M., Yeoh, A., and Zhang, K.IEEE International Electron Devices Meeting, San Francisco, CA, December 15−17, 2008.
2. Process Integration and Manufacturasility Issues for High Performance Multilevel Interconnect