Film Crystallographic Texture and Substrate Urface Roughness in Layered Aluminum Metallization

Abstract

AbstractMaterial anisotropy implies that many film properties are affected by crystallographic orientation in the growth direction (out-of-plane texture) and / or in the plane of growth (in-plane texture). Physical vapor deposited (PVD) Ti and Al-alloy films deposited on silicon dioxide substrates typically exhibit strong fiber textures in the growth direction with little in-plane-texture observed. The strength of these fiber textures has been found to vary substantially depending on the details of the deposition process(es) and, to a lesser degree, on any post-deposition anneals. In this paper the role of the substrate surface roughness in defining film texture is reported. It was found that the substrate surface roughness determines the overlying film crystallographic orientation for Ti and Ti/AlCu films deposited on various oxides. Furthermore, it was found that the texture of the initial metal “seed” layer defines the texture in subsequently deposited films (texture inheritance). Modifications to the oxide surface which decrease the surface roughness lead to an improved crystallographic texture in Ti, AlCu, Ti/AlCu and Ti/TiN/AlCu films. Film orientation was determined from crystallographic pole figures measured using x-ray diffraction (XRD). The oxide surface roughness was measured using atomic force microscopy (AFM), transmission electron microscopy (TEM) and glancing incidence x-ray reflectivity (GIXR).