Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu

Author:

Lucadamo G.,Barmak K.,Rodbell K. P.

Abstract

Fiber texture in Ti/Al and Nb/Al polycrystalline multilayer thin films, with bilayer thicknesses (Λ) ranging from 20–333 nm and having a fixed stoichiometry of 1/3, has been investigated by using x-ray pole figures and transmission electron microscopy. Two sets of films were deposited; one set contained pure Al and the other Al–1.0 wt% Cu. The results indicated that texture was strengthened by the formation of a coherent superlattice for the Nb/pure-Al film with the smallest bilayer thickness. By contrast, the texture in Ti/pure-Al films with a similar period was not as strong. The texture also decreased with increasing Λ for both the Ti/pure-Al and Nb/pure-Al films. An increase in the width of the Al (111) peak and an offset of the fiber axis from the substrate normal of 5–8° was observed in the Λ = 333 nm films prepared by using Al–1.0 wt% Cu. The decrease in texture on addition of Cu to Al was attributed primarily to an increase in interlayer roughness as a consequence of reduction in the Al(Cu) grain size. These observations were interpreted in the context of structure zone and dynamic roughness models of film growth.

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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