Experimental study of electromigration in bicrystal aluminum lines
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.107035
Reference11 articles.
1. Grain size dependence of electromigration‐induced failures in narrow interconnects
2. A new electromigration testing technique for rapid statistical evaluation of interconnect technology
3. The electromigration failure distribution: The fine‐line case
4. Electromigration in aluminum conductors which are chains of single crystals
5. Anomalous large grains in alloyed aluminum thin films II. Electromigration and diffusion in thin films with very large grains
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3. Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces;International Journal of Solids and Structures;2005-06
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