Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1795353
Reference14 articles.
1. Electromigration induced resistance decrease in Sn conductors
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4. In situstudy of void growth kinetics in electroplated Cu lines
5. Electromigration in metals
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