Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing

Author:

Liang Shuibao,Wei Cheng,Kunwar AnilORCID,Subedi UpadeshORCID,Jiang Han,Ma Haoran,Ke ChangboORCID

Funder

Guangdong Provincial Natural Science Foundation

Narodowe Centrum Nauki

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,General Physics and Astronomy,Condensed Matter Physics,Surfaces and Interfaces,General Chemistry

Reference79 articles.

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3. A review of intermetallic compound growth and void formation in electrodeposited Cu–Sn Layers for microsystems packaging;Kannojia;J. Mater. Sci. Mater. Electron.,2021

4. Extremely fast formation of CuSn intermetallic compounds in Cu/Sn/Cu system via a micro-resistance spot welding process;Liu;J. Alloy. Compd.,2016

5. Thermo-mechanical characteristics and reliability of die-attach through self-propagating exothermic reaction bonding;Liang;IEEE Trans. Compon. Packag. Manuf. Technol.,2021

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