Funder
Engineering and Physical Sciences Research Council (EPSRC) Research Grants, U.K.
Underpinning Power Electronics 2017–Heterogeneous Integration (HI) Project
Quasi-Ambient Bonding to Enable Cost-Effective High Temperature Pb-Free Solder Interconnects (QAB) Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
9 articles.
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