Temperature-dependent activation energy of electromigration in Cu/porous low-k interconnects
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4998523
Reference35 articles.
1. Low dielectric constant materials for microelectronics
2. Calculation of Cu/Ta interface electron transmission and effect on conductivity in nanoscale interconnect technology
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5. Influence of absorbed water components on SiOCH low-k reliability
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