Influence of absorbed water components on SiOCH low-k reliability-Reference-Cited by-同舟云学术

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Influence of absorbed water components on SiOCH low-k reliability

Published:2008-08 Issue:3 Volume:104 Page:034113
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Li Yunlong,Ciofi Ivan,Carbonell Laureen,Heylen Nancy,Van Aelst Joke,Baklanov Mikhaïl R.,Groeseneken Guido,Maex Karen,Tőkei Zsolt

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2966578

Reference20 articles.

1. Low dielectric constant materials for microelectronics

2. Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma

3. Proceedings of the IEEE-IRPS;Tsu R.,2000

4. Critical role of degassing for hot aluminum filling

5. Compensation effect during water desorption from siloxane-based spin-on dielectric thin films

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