A Space–Time Neural Network for Analysis of Stress Evolution Under DC Current Stressing

Author:

Hou Tianshu1ORCID,Wong Ngai2ORCID,Chen Quan3ORCID,Ji Zhigang1ORCID,Chen Hai-Bao1ORCID

Affiliation:

1. Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China

2. Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong

3. School of Microelectronics, Southern University of Science and Technology, Shenzhen, China

Funder

National Key Research and Development Program of China

Nature Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Temperature and current density prediction in solder joints using artificial neural network method;Soldering & Surface Mount Technology;2023-12-04

2. Analytical Post-Voiding Modeling and Efficient Characterization of EM Failure Effects Under Time-Dependent Current Stressing;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-12

3. Linear Time Electromigration Analysis Based on Physics-Informed Sparse Regression;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-11

4. PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28

5. Multilayer Perceptron-Based Stress Evolution Analysis Under DC Current Stressing for Multisegment Wires;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-02

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