Multilayer Perceptron-Based Stress Evolution Analysis Under DC Current Stressing for Multisegment Wires

Author:

Hou Tianshu1ORCID,Zhen Peining1ORCID,Wong Ngai2ORCID,Chen Quan3ORCID,Shi Guoyong1ORCID,Wang Shuqi1ORCID,Chen Hai-Bao1ORCID

Affiliation:

1. Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China

2. Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong

3. School of Microelectronics, Southern University of Science and Technology, Shenzhen, China

Funder

National Key Research and Development Program of China

Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Analytical Post-Voiding Modeling and Efficient Characterization of EM Failure Effects Under Time-Dependent Current Stressing;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-12

2. PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28

3. Spatiotemporal Generative Adversarial Imputation Networks: An Approach to Address Missing Data for Wind Turbines;IEEE Transactions on Instrumentation and Measurement;2023

4. HierPINN-EM;Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design;2022-10-30

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